2023-24 John Ries Scholarship Is Now Open for Students

The Expanded Shale, Clay, and Slate Institute (ESCSI) is pleased to announce applications are open for our John Ries Scholarship in Academic Year 2023-24. This scholarship, worth $5,000, is awarded to one student every year.

Applications are accepted as self-nominations by undergraduate or graduate students in civil engineering or closely related majors who are enrolled in fall 2023 and will return to school for spring 2024. Once a winner is selected, the scholarship will be awarded in person by an ESCSI representative and will be announced on the ESCSI web and social media.

Students can apply by:

  • – Filling out the online application.
  • – Emailing their application and attachments to info@escsi.org with the subject line “John Reis Scholarship.”
  • – Printing out and mailing their completed application and attachments to the address listed below.

Expanded Shale, Clay and Slate Institute
35 East Wacker Dr., Suite 850
Chicago, IL 60601

Please note, applications must be submitted electronically or postmarked no later than January, 31, 2024.

Applications should include the following items:

  1. The application form signed by the applicant (electronic signature is acceptable);
  2. A one-page statement of qualifications by student describing motivation in ESCS materials; academic and career goals related to ESCS applications; planned research- or practice-based projects involving ESCS materials; and/or the value of this scholarship to achieve goals or complete projects (letter-size, single-spaced, 1” margin, font size 12, doc or pdf);
  3. Unofficial transcripts indicating the current GPA of 2.75 or higher (pdf);
  4. A confidential letter of recommendation by a faculty; signed, dated, and sealed; or sent directly via email to ESCSI by the faculty with the subject “John Ries Scholarship”.

If you have any questions about the scholarship related to eligibility or the application process, don’t hesitate to email us at info@escsi.org.

By ESCSI | December 19, 2023 | ESCSI News